Discussion on the advantages and disadvantages of heat conduction and heat dissipation design materials for LED lighting fixtures
　 Thermal part: circuit substrate, caulking material, housing material
Heat sink: shell design, surface design, surface material
Next, Xiaobian compiled the advantages and disadvantages of these materials, you are welcome to join to discuss.
Thermal part
Circuit substrate
Fiberglass board
advantage:
Low cost and easy to make
No need to consider insulation properties
Disadvantages:
Not suitable for LED design with heat sink and electrode
Need to fill the hole with tin, increase the process
Thick copper foil layer is needed to increase heat transfer efficiency
Aluminum plate
advantage:
Generally accepted
Harder than FR4, better thermal conductivity with heat sink
Electrical insulation is higher than fiberglass board
Disadvantages:
The price is higher than FR4
Less able to place other electronic components on the substrate
The thermal conductivity of the insulation layer is difficult to grasp
Copper substrate
advantage:
Thermal conductivity is much higher than aluminum substrate
Low specific heat value, easier to pull up the conduction temperature
Same advantages as aluminum substrates
Disadvantages:
High cost, general design is not applicable
Has the same disadvantages as aluminum substrates
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