LED epitaxy gradually tends to expand the 4-inch capacity of large-scale Taiwanese manufacturers

According to Taiwan media reports, in order to improve production efficiency, more and more LED epitaxial plants have accelerated the expansion of 4吋, or even 6吋 epitaxial capacity. Not only did South Korea's Samsung LEDs use a 4-inch machine to mass-produce LEDs in 2010, but Philips Lumileds announced the official mass production of 6-inch LEDs at the end of 2010. Taiwan's LED epitaxial wafers, as well as AUO's LED vertical integration giant Ronda, are also planning to further expand the 4 吋 wafer capacity technology in 2011.

It is understood that when the company purchased the MOCVD machine in 2010, it has already imported some 4-inch machines. The market expects that the company will expand production of 4 吋 LED epitaxial wafers in 2011, making it possible for 30% of production capacity to be produced in 4 吋 machines in 2011.

Ronda has been involved in the LED epitaxial process from the beginning, and has actively introduced the 4 吋 晶片 wafer production technology. According to the company's plan, by the end of 2010, the number of 4-inch machines has exceeded 2 吋. In order to strengthen the technical mastery of the large-scale process of LED epitaxial wafers, Ronda announced at the end of 2010 that its laboratory has successfully produced 6 吋 晶片 wafers, and will have the opportunity to introduce mass production by the end of 2011 at the earliest.

LED epitaxial manufacturers have recently gradually developed toward LED epitaxial large-scale processes, mainly to improve production efficiency. Comparing the production capacity of each size machine, the production capacity of 6 吋 晶片 wafers for cutting LED dies can be up to 2 times that of 4 吋 晶片 wafers, which is equivalent to 3-4 times that of 3 吋 晶片 wafers. 8-9 times, the LED die capacity of the 4 吋 晶片 wafer is about 4 times that of the 2 吋 晶片 wafer.

However, due to the larger size of the sapphire substrate, the price is more expensive. For example, the price of 2 sapphire substrates at the end of 2010 is about 25-30 US dollars per piece, but the price of 4 sapphire substrates is as high as 120 US dollars or more. In contrast, cutting LED chips with 2 吋 晶片 wafers is still relatively cost-effective. Therefore, the number of LED epitaxial/die manufacturers that actually invested in mass production of 4 吋 machines in 2010 is still limited.

At the same time, we learned that the main LED epitaxial/die manufacturers such as Yuyuan, New Century and Taigu, and the MOVCD machines introduced in 2010, are mainly based on 2吋 machines. At present, it is mainly used in the production of LED dies.

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