SPC563M64L7 main features and block diagram _Discovery Plus development board

ST's SPC563M64L7 is a 32-bit Power Architecture MCU for automotive powertrains. It is a system-on-chip (SoC) with high-performance 90nm CMOS technology with many new features to reduce cost and improve performance. Power Architecture® technology is supported. Additional instructions for DSP, such as enhanced time processing unit, enhanced queued analog-to-digital converter, control area network (CAN) and enhanced module input/output system. In addition, the device also integrates 94KB SRAM and 1.5MB flash memory. The main features of SPC563M64L7, block diagram, and SPC563Mxx series Discovery Plus development board SPC563M-DISP main features and circuit diagram, PCB top layout.

These 32-bit automoTIve microcontrollers are a family of System-on-Chip (SoC) devices that contain many new features coupled with high performance 90 nm CMOS technology to provide substanTIal reducTIon of cost per feature and significant performance improvement. The advanced and cost- The active host processor core of this automoTIve controller family is built on Power Architecture® technology. This family contains enhancements that improve the architecture's fit in embedded applications, includes additional instruction support for Digital Signal Processing (DSP), integrates technologies—such as an enhanced time The processor has a significant level of memory hierarchy consisting of up to 94 KB on-chip SRAM and up to 1.5 MB of internal flash memory. The device also has an External Bus Interface (EBI) for 'calibration'.

Main features of SPC563M64L7:

Single issue, 32-bit Power Architecture® Book E compliant e200z335 CPU core complex

– Includes Variable Length Encoding (VLE) enhancements for code size reduction 

32-channel Direct Memory Access controller (DMA) ï‚·

Interrupt Controller (INTC) capable of handling 364 selectable-priority interrupt sources: 191 peripheral interrupt sources, 8 software interrupts and 165 reserved interrupts.

Frequency-Modulated Phase-Locked Loop (FMPLL) ï‚·

Calibration External Bus Interface (EBI)(a) ï‚·

System Integration Unit (SIU) ï‚·

Up to 1.5 Mbyte on-chip Flash with Flash controller

– Fetch Accelerator for single cycle Flash access @80 MHz

Up to 94 Kbyte on-chip static RAM (including up to 32 Kbyte standby RAM) ï‚·

Boot Assist Module (BAM) ï‚·

32-channel second-generation enhanced Time Processor Unit (eTPU)

– 32 standard eTPU channels

– Architectural enhancements to improve code efficiency and added flexibility 

16-channels enhanced Modular Input-Output System (eMIOS) ï‚·

Enhanced Queued Analog-to-Digital Converter (eQADC) ï‚·

Decimation filter (part of eQADC) ï‚·

Silicon die temperature sensor ï‚·

2 Deserial Serial Peripheral Interface (DSPI) modules (compatible with Microsecond Bus)

2 enhanced Serial Communication Interface (eSCI) modules compatible with LIN

2 Controller Area Network (FlexCAN) modules that support CAN 2.0B ï‚·

Nexus Port Controller (NPC) per IEEE-ISTO 5001-2003 standard ï‚·

IEEE 1149.1 (JTAG) support ï‚· Nexus interface ï‚·

On-chip voltage regulator controller that provides 1.2 V and 3.3 V internal supplies from a 5 V external source.

Designed for LQFP144, and LQFP176

The SPC563Mxx series microcontrollers are system-on-chip devices that are built on Power Architecture® technology and:

ï‚·Are 100% user-mode compatible with the Power Architecture instruction set ï‚·Contain enhancements that improve the architecture's fit in embedded applications ï‚·

Include additional instruction support for digital signal processing (DSP)ï‚·

Integrate technologies such as an enhanced time processor unit, enhanced queued analog-to-digital converter, Controller Area Network, and an enhanced modular input-output system

Operating Parameters

– Fully static operation, 0 MHz

– 80 MHz (plus 2% frequency modulation - 82 MHz)

– –40 C–150 C junction temperature operating range

– Low power design

Less than 400 mW power dissipation (nominal)

Designed for dynamic power management of core and peripherals

Software controlled clock gating of peripherals

Low power stop mode, with all clocks stopped

– Fabricated in 90 nm process

– 1.2 V internal logic 

High performance e200z335 core processor ï‚·

Advanced microcontroller bus architecture (AMBA) crossbar switch (XBAR) ï‚·

Enhanced direct memory access (eDMA) controller ï‚·

Interrupt controller (INTC)

– 191 peripheral interrupt request sources, plus 165 reserved positions

– Low latency—three clocks from receipt of interrupt request from peripheral to interrupt request to processor 

Frequency Modulating Phase-locked loop (FMPLL) ï‚·

Calibration bus interface (EBI) (available only in the calibration package) System integration unit (SIU) centralizes control of pads, GPIO pins and external interrupts.

Error correction status module (ECSM) provides configurable error-correcting codes (ECC) reporting

Up to 1.5 MB on-chip flash memory ï‚·

Up to 94 KB on-chip static RAM ï‚·

Boot assist module (BAM) enables and manages the transition of MCU from reset to user code execution from internal flash memory, external memory on the calibration bus or download and execution of code via FlexCAN or eSCI.

Periodic interrupt timer (PIT)

– 32-bit wide down counter with automatic reload

– 4 channels clocked by system clock

– 1 channel clocked by crystal clock 

System timer module (STM)

– 32-bit up counter with 8-bit prescaler

– Clocked from system clock

– 4 channel timer compare hardware 

Software watchdog timer (SWT) 32-bit timer ï‚·

Enhanced modular I/O system (eMIOS)

– 16 standard timer channels (up to 14 channels connected to pins in LQFP144)

– 24-bit timer resolution 

Second-generation enhanced time processor unit (eTPU2)

– High level assembler/compiler

– Enhancements to make 'C' compiler more efficient

– New 'engine relative' addressing mode 

Enhanced queued A/D converter (eQADC)

– 2 independent on-chip RSD Cyclic ADCs

– Up to 34 input channels available to the two on-chip ADCs

– 4 pairs of differential analog input channels 

2 deserial serial peripheral interface modules (DSPI)

– SPI provides full duplex communication ports with interrupt and DMA request support

– Deserial serial interface (DSI) achieves pin reduction by hardware serialization and deserialization of eTPU, eMIOS channels and GPIO 

2 enhanced serial communication interface (eSCI) modules ï‚·

2 FlexCAN modules ï‚·

Nexus port controller (NPC) per IEEE-ISTO 5001-2003 standard ï‚· IEEE 1149.1 JTAG controller (JTAGC)

SPC563M64L7 main features and block diagram _Discovery Plus development board

Figure 1. Block diagram of the SPC563Mxx series

SPC563Mxx Series Discovery Plus Development Board SPC563M-DISP

The SPC563M-DISP Discovery kit helps you to discover SPC56 M line Power Architecture® Microcontrollers. The discovery board is based on SPC563M64L7, a 32-bit Power Architecture Book E compliant e200z335 CPU core with 1.5Mbyte on-chip in an LQFP176 package. Singular interfaces including CAN/SCI/K-LINE/DSPI/GPIO make the SPC56M-Discovery an excellent starter kit for customer quick evaluation and project development. The SPC56 M family is designed to address cost sensitive powertrain and transmission applications. The SPC56 M line Key functionality is Time processing units (eTPU) a coprocessor to create events in sync with internal or external signals without flooding the CPU with interrupt to serve.

Figure 2. Outline of the Discovery Plus development board SPC563M-DISP

Figure 3. Overview of the Discovery Plus development board SPC563M-DISP hardware

SPC563M64L7 main features and block diagram _Discovery Plus development board

Figure 4. Discovery Plus development board SPC563M-DISP circuit diagram

SPC563M64L7 main features and block diagram _Discovery Plus development board

Figure 5. Top of the PCB layout of the Discovery Plus development board SPC563M-DISP

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