Toshiba plans to close three semiconductor factories and cut half of the 6-inch wafer line
Recently, Toshiba announced that it will close three semiconductor factories in Japan and rectify it to strengthen its operational structure and enhance the profitability of discrete components, analog and imaging ICs. In addition, Toshiba plans to halve the 6-inch wafer line of the Oita Plant in the first half of 2012.
Toshiba said that the reorganization will reorganize six discrete semiconductor component plants in the front-end and back-end processes into three major plants, including Himeji Semiconductor Factory in Hyogo Prefecture, Kaga Toshiba Electronics Co., Ltd. in Ishikawa Prefecture, and Fukuoka Prefecture. Toyo Toshiba Electronics. In addition, in the first half of 2012, three plants will be phased out: the North Kyushu Island Plant and the Hamaoka Toshiba Electronics Company, and the power semiconductor assembly plant Toshiba Components.
After the reorganization of the semiconductor factory, Himeji Plant will continue to strengthen the functions of the power semiconductor and small signal component R&D center. The Kaga plant will increase the production capacity of the current 8-inch wafer production line and expand the production capacity of the optoelectronic semiconductor front-end process. The former factory has a new position as a research and development center for optoelectronic semiconductor assembly and packaging technology.
In addition to rectification measures, Toshiba will reduce semiconductor production in response to the decline in demand and consumer products such as personal computers and televisions in Europe and the United States. The production of six factories will be affected from the end of November to the beginning of January next year.
　
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