Luo Xiaobing, Huazhong University of Science and Technology: Thermal Management in High Power LED Packaging and Applications

On March 20th, the 5th LED Industry Theme Summit Forum was successfully concluded at Dongli Lake Hotel in Dongli District, Tianjin. The forum was organized by domestic well-known industry research, media organization Gaogong LED and Tianjin Dongli District People's Government, Tianjin. The city's Science and Technology Committee co-hosted nearly 300 industry leaders from across the country to participate in the forum. Speakers include Zhang Youhui, Secretary of Tianjin Dongli District, Chen Yansheng, Chairman of China Lighting Association, and Guan Baiyu, Deputy Inspector of Electronic Information Department of Ministry of Industry and Information Technology. Senior executives from industry bodies and governments, as well as Tang Guoqing, general manager of CREE China Market, Dr. Zong Mingcheng, Director of Solid State Lighting Standardization, Philips Lighting Asia Pacific, Yang Lan, Senior Sales Manager of OSRAM, Sun Hui, GE Systems Engineering Manager, and other international giants. There are many representatives and investors of domestic LED business leaders. This forum attracted nearly 300 high-level representatives from 136 companies in the LED industry in 19 provinces, cities and regions.

The topics of this forum cover the hot topics of current LED industry such as market opportunities, technology trends, and ten cities: semiconductor lighting technology and market forecast, LED street light technology, EMC and patent risks and countermeasures, LED market in 2010 Features and competitive factors, etc., including LED technology and all aspects of the market. Such as: semiconductor lighting technology, market status and prospects; LED lighting and standardization; EMC opportunities and risks; LED street lamp structure and system design; LED corporate financing, listing issues to pay attention to, etc., experts at each meeting, all aspects of the LED industry A thorough and in-depth discussion took place.

In the face of heat and heat dissipation problems faced by high-power LEDs, Professor Luo Xiaobing from Huazhong University of Science and Technology explained the thermal management technology in his high-power LED package and application. Professor Luo Xiaobing pointed out in his speech that the heat dissipation problem of LED devices is a systematic problem. There are LED chip thermal resistance, interface material thermal resistance, diffusion thermal resistance, environmental thermal resistance, etc. "We should reduce all thermal resistance at the same time is the key to solving heat dissipation." He believes that by developing multi-layer ceramic technology and achieving integration and multi-function of LED packaging, reducing the size of LED packaging systems and reducing packaging costs are the main trends of CoB technology.

Professor Luo Xiaobing, Huazhong University of Science and Technology

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