Powerful microcontroller

Filter 18.432M

Try to design the hardware system in the "single-chip" direction. The more system devices, the stronger the mutual interference between devices, and the greater the power consumption, which inevitably reduces the stability of the system. As the integrated functions of the on-chip chip become more and more powerful, the real system-on-chip SoC can be realized. For example, the C8051F MCU is a fully integrated mixed-signal system-on-chip (SoC) with a high-speed CIP-51 core compatible with 805 1 . Fully compatible with the MCS-51 instruction set, the chip integrates analog, digital peripherals and other functional components commonly used in data acquisition and control systems; built-in FLASH program memory, internal RAM, and most of the internal memory space in the device. RAM, printed XRAM o C8051F microcontroller has on-chip debugging circuit, through the 4-pin JTAG interface for non-intrusive, full-speed online system debugging. '(5) Measures to eliminate interference The main methods are to eliminate the interference. The power supply is well done, and the anti-interference of the whole circuit is solved. Many single-chip microcomputers are very sensitive to power supply noise. It is necessary to add a filter circuit or a voltage regulator to the power supply of the single-chip microcomputer to reduce the interference of the power supply noise on the single-chip microcomputer. For example, a magnetic bead and a capacitor can be used to form a spike-shaped filter circuit. Of course, a 100 Q resistor can be used instead of a magnetic bead when conditions are not high.

If the I/O port of the MCU uses the I/O port to control the noise device such as the motor, the I/O port should be isolated from the noise source (increasing the shape filter circuit). The crystal oscillator crystal oscillator and the MCU pin should be as close as possible, and the ground wire should be used. The clock area is isolated, the crystal housing is grounded and the partition is properly partitioned, such as strong and weak signals, digital and analog signals. Try to isolate interference sources (such as motors, relays) and sensitive components (such as microcontrollers) from the ground and ground to isolate the digital zone from the analog zone. The digital ground is separated from the analog ground, and finally connected to the power ground at one point. The A/D and D/A chip wirings are also grounded on the ground. The grounding of the MCU and the high-power device should be grounded separately to reduce mutual interference. High-power devices should be placed on the edge of the circuit board as much as possible. Anti-interference measures such as magnetic beads, magnetic rings, power filters, and shields can be used in key areas such as the I/O port, power line, and circuit board connection. Significantly improve the anti-interference performance of the circuit. Improving the anti-jamming performance to improve the anti-interference performance of sensitive devices refers to the method of minimizing the pick-up of interference noise and recovering from an abnormal state as soon as possible from the sensitive device side. Common measures to improve the anti-jamming capability of sensitive devices are as follows: • Minimize the loop loop area during wiring to reduce induced noise. • When wiring, the power and ground wires should be as thick as possible. In addition to reducing the voltage drop, it is more important to reduce the coupling noise. · For the I70 port that the MCU is idle, do not hang it, ground it or connect it to the power supply. The idle ends of other ICs are grounded or connected to the power supply without changing the system logic. · Use power monitoring and watchdog circuits for single-chip microcomputers, such as IMP809, IMP706, IMP813, X5043, X5045, etc., to greatly improve the anti-interference performance of the entire circuit. · Under the premise that the speed can meet the requirements, try to reduce the crystal oscillator of the single chip and select the low speed digital circuit. · IC devices are soldered directly to the board as much as possible, and IC seats are used less.